This paper presents a novel approach to interconnect fault location for FPGAs during power-on sequence. The method is based on a concept known as fault grading which utilizes defect knowledge during manufacturing test to classify faulty devices into different defect groups. A Built-In Self-Test (BIST) method that can efficiently identify the exact location of the interconnect fault is introduced. This procedure forms the first step of a new interconnect defect tolerant scheme that offers the possibility of using larger and more cost effective devices that contain interconnect defects without compromising on performance or configurability.
Nicola Campregher, Peter Y. K. Cheung, Milan Vasil