CAD Implications of New Interconnect Technologies

This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a replacement for metal interconnects, and optical interconnections for longer range on-chip communication. Each of these requires new CAD support to be used effectively. Categories and Subject Descriptors B.7.1 [Integrated Circuits]: Types and Design Styles-Advanced technologies, VLSI ; B.7.2 [Integrated Circuits]: Design Aids--Placement and routing General Terms Algorithms, Design, Performance Keywords 3D interconnect, Nanotubes, On-chip optical

• Type: Conference
• Year: 2007
• Where: DAC
• Authors: Louis Scheffer
• Keywords: Computer Architecture, DAC 2007, Design Styles-Advanced Technologies, Integrated Circuits, Range On-chip Communication