This paper reports on the systematic electromechanical characterization of a new three-axial force sensor used in dimensional metrology of micro components. The silicon based sensor system consists of piezoresistive mechanical stress transducers integrated in thin membrane hinges supporting a suspended flexible cross structure. The mechanical behavior of the fragile micromechanical structure is analyzed for both static and dynamic load cases. This work demonstrates that the silicon microstructure withstands stat
Stefan Spinner, J. Bartholomeyczik, Bernd Becker,