High Density out-of-Plane Microprobe Array

In this paper, the high density out-of-plane microprobe array is demonstrated. The fabrication processes of proposed device including bulk micromachining, thin film deposition and electroplating. By depositing the various thickness of thin film with residual tensile stress, the deflection of bending beam could be precisely controlled. The horizontal variation of bending beam array could also restrict in a few micrometer. The concept for the device fabrication is depositing the Ti thin film on a suspension SiO2 cantilever to bring out-of-plane bending deformation, and then use electroplating process such as low stress Ni film to increase the stiffness of the probe structure without change the beam's bending profile. Through the different electroplating bath, the bending microprobe with different material, such as Ni and Cu, could be fabricated for IC testing and interconnection applications. According to the mask design, the high density probe array could easily achieve. The protot...

• Type: Journal
• Year: 2008
• Where: CORR
• Authors: C. H. Huang, Chingfu Tsou, Tenghsien Lai
• Keywords: Bending, CORR 2008, Education, Microprobe Array, Out-of-plane Microprobe Array