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TCAD
2010

Multilayer Global Routing With Via and Wire Capacity Considerations

13 years 1 months ago
Multilayer Global Routing With Via and Wire Capacity Considerations
Global routing for modern large-scale circuit designs has attracted much attention in the recent literature. Most of the state-of-the-art academic global routers just work on a simplified routing congestion model that ignores the essential via capacity for routing through multiple metal layers. Such a simplified model would easily cause fatal routability problems in subsequent detailed routing. To remedy this deficiency, a more effective congestion metric that considers both the in-tile nets and the residual via capacity for global routing is presented. Experimental results show that our global router can achieve very high-quality routing solutions with more reasonable via usage.
Chin-Hsiung Hsu, Huang-Yu Chen, Yao-Wen Chang
Added 21 May 2011
Updated 21 May 2011
Type Journal
Year 2010
Where TCAD
Authors Chin-Hsiung Hsu, Huang-Yu Chen, Yao-Wen Chang
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