Parametric structure-preserving model order reduction

Abstract—Analysis and verification environments for nextgeneration nano-scale RFIC designs must be able to cope with increasing design complexity and to account for new effects, such as process variations and Electromagnetic (EM) couplings. Designed-in passives, substrate, interconnect and devices can no longer be treated in isolation as the interactions between them are becoming more relevant in the behavior of the complete system. At the same time variations in process parameters lead to small changes in the device characteristics that may directly affect system performance. These two effects, however, can not be treated separately as the process variations that modify the physical parameters of the devices also affect those same EM couplings. Accurately capturing the effects of process variations as well as the relevant EM coupling effects requires detailed models that become very expensive to simulate. Reduction techniques able to handle parametric descriptions of linear systems...

• Type: Conference
• Year: 2007
• Where: VLSI
• Authors: Jorge Fernandez Villena, Wil H. A. Schilders, L. Miguel Silveira
• Keywords: Em Coupling, EM Coupling Effects, Process Variations, Software Engineering, VLSI 2007