Temperature aware microprocessor floorplanning considering application dependent power load

This paper studies microprocessor floorplanning considering thermal and throughput optimization. We first develop a stochastic heat diffusion model taking into account the application dependent power load for thermal analysis. Then, we design the floorplanning algorithm based on this model. Experimental results show that, compared with the deterministic heat diffusion model, our model obtains up to 3.2o C

• Type: Conference
• Year: 2007
• Where: ICCAD
• Authors: Chunta Chu, Xinyi Zhang, Lei He, Tong Jing
• Keywords: Dependent Power Load, Deterministic Heat, Hardware, Heat Diffusion Model, ICCAD 2007