A Two-Step Etching Method to Fabricate Nanopores in Silicon

A cost effectively method to fabricate nanopores in silicon by only using the conventional wet-etching technique is developed in this research. The main concept of the proposed method is a two-step etching process, including a premier double-sided wet etching and a succeeding track-etching. A special fixture is designed to hold the pre-etched silicon wafer inside it such that the track-etching can be effectively carried out. An electrochemical system is employed to detect and record the ion diffusion current once the pre-etched cavities are etched into a through nanopore. Experimental results indicate that the proposed method can cost effectively fabricate nanopores in silicon.

• Type: Journal
• Year: 2008
• Where: CORR
• Authors: G.-J. Wang, W.-Z. Chen, K. J. Chang
• Keywords: Conventional Wet-etching Technique, CORR 2008, Education, Premier Double-sided Wet, Two-step Etching Process