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GLVLSI
2005
IEEE
120views VLSI» more  GLVLSI 2005»
14 years 3 months ago
3D module placement for congestion and power noise reduction
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh
VRCAI
2004
ACM
14 years 3 months ago
Real time 3D avatar for interactive mixed reality
This paper presents real-time reconstruction of dynamic 3D avatar for interactive mixed reality. In computer graphics, one of the main goals is the combination of virtual scenes w...
Sang Yup Lee, Ig-Jae Kim, Sang Chul Ahn, Heedong K...
IBPRIA
2003
Springer
14 years 2 months ago
Regularization of 3D Cylindrical Surfaces
In this paper we present a method for the regularization of 3D cylindrical surfaces. By a cylindrical surface we mean a 3D surface that can be expressed as an application S(l, θ) ...
Luis Álvarez, Carmelo Cuenca, Javier S&aacu...
ICCV
2011
IEEE
12 years 9 months ago
3D Scene Flow Estimation with a Rigid Motion Prior
We present an approach to 3D scene flow estimation, which exploits that in realistic scenarios image motion is frequently dominated by observer motion and independent, but rigid ...
Christoph Vogel, Stefan Roth, Konrad Schindler
ICCV
2011
IEEE
12 years 9 months ago
A New Distance for Scale-Invariant 3D Shape Recognition and Registration
This paper presents a method for vote-based 3D shape recognition and registration, in particular using mean shift on 3D pose votes in the space of direct similarity transforms for...
Minh-Tri Pham, Oliver J. Woodford, Frank Perbet, A...