3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
In this contribution, we are concerned with the detection and re ned localization of 3D point landmarks. We propose multi-step di erential procedures for subvoxel localization of 3...
When drafting new buildings, architects make intensive use of existing 3D models including building elements, furnishing, and environment elements. These models are either directl...
This paper describes a new robust and fully automatic method for calibration of three-dimensional (3D) freehand ultrasound. 3D Freehand ultrasound consists in mounting a position s...
We present an algorithm for jointly learning a consistent bidirectional generative-recognition model that combines top-down and bottom-up processing for monocular 3d human motion ...
Cristian Sminchisescu, Atul Kanaujia, Dimitris N. ...