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CASES
2010
ACM
13 years 6 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
ECCV
1998
Springer
14 years 11 months ago
1998
Springer
In this contribution, we are concerned with the detection and re ned localization of 3D point landmarks. We propose multi-step di erential procedures for subvoxel localization of 3...
3DOR
2009
13 years 10 months ago
2009
When drafting new buildings, architects make intensive use of existing 3D models including building elements, furnishing, and environment elements. These models are either directl...
MICCAI
2003
Springer
14 years 10 months ago
2003
Springer
This paper describes a new robust and fully automatic method for calibration of three-dimensional (3D) freehand ultrasound. 3D Freehand ultrasound consists in mounting a position s...
CVPR
2006
IEEE
14 years 3 months ago
2006
IEEE
We present an algorithm for jointly learning a consistent bidirectional generative-recognition model that combines top-down and bottom-up processing for monocular 3d human motion ...