3 search results - page 1 / 1 » 3D thermal-ADI: an efficient chip-level transient thermal si... |
TCAD
2002
13 years 10 months ago
2002
Abstract--Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three
ISPD
2003
ACM
14 years 4 months ago
2003
ACM
ICCD
2005
IEEE
14 years 4 months ago
2005
IEEE
As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to re...