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SLIP
2009
ACM
14 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
ICDCSW
2005
IEEE
14 years 1 months ago
State Checksum and Its Role in System Stabilization
Although a self-stabilizing system that suffers from a transient fault is guaranteed to converge to a legitimate state after a finite number of steps, the convergence can be slow ...
Chin-Tser Huang, Mohamed G. Gouda
ICPP
2006
IEEE
14 years 1 months ago
Using Gossip for Dynamic Resource Discovery
— Resource discovery is the process of locating shared resources on a computer network. Previously studied examples include efficiently finding files with a given title on a ...
Eric Simonton, Byung Kyu Choi, Steven Seidel
ICDCSW
2002
IEEE
14 years 10 days ago
A Physically Grounded Approach to Coordinate Movements in a Team
This paper focuses on the problems of coordinating the movements of a cooperative team in an environment, and proposes an approach that takes inspiration from the laws of physics....
Letizia Leonardi, Marco Mamei, Franco Zambonelli
TC
2010
13 years 2 months ago
Generating Reliable Code from Hybrid-Systems Models
Hybrid systems have emerged as an appropriate formalism to model embedded systems as they capture the theme of continuous dynamics with discrete control. Under this paradigm, distr...
Madhukar Anand, Sebastian Fischmeister, Yerang Hur...