9 search results - page 2 / 2 » A Digital-Microfluidic Approach to Chip Cooling |
PATMOS
2000
Springer
13 years 11 months ago
2000
Springer
Abstract. Reduction of chip packaging and cooling costs for deep sub-micron SystemOn-Chip (SOC) designs is an emerging issue. We present a simulation-based methodology able to real...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
In this paper, we study the interdependency between leakage energy and chip temperature in real-time systems. We observe that the temperature variation on chip has a large impact ...
ASPLOS
2004
ACM
14 years 23 days ago
2004
ACM
Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
DFT
2006
IEEE
14 years 1 months ago
2006
IEEE
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...