383 search results - page 52 / 77 » A Methodology for High Level Power Estimation and Exploratio... |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Economic incentives have driven the semiconductor industry to separate design from fabrication in recent years. This trend leads to potential vulnerabilities from untrusted circui...
ICRA
2005
IEEE
14 years 1 months ago
2005
IEEE
Abstract— We are developing a swarm-intelligent inspection system based on a swarm of autonomous, miniature robots, using only on-board, local sensors. To estimate intrinsic adva...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
LCN
2006
IEEE
14 years 1 months ago
2006
IEEE
— The paper presents a thought experiment as to the feasibility of using large scale wireless sensor networks as a vehicle for high level scientific investigation. The discussion...
DATE
2010
IEEE
14 years 26 days ago
2010
IEEE
—Variations of process parameters have an important impact on reliability and yield in deep sub micron IC technologies. One methodology to estimate the influence of these effects...