The miniaturization of transistors in recent technology nodes requires tremendous back-end tuning and optimizations, making bug fixing at later design stages more expensive. Ther...
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
In this paper, we present a Grid computing platform that provides experimental scientists and analysts with access to computational simulations and knowledge databases hosted in s...
Xingchen Chu, Andrew Lonie, Peter Harris, S. Randa...
— The communication sub-system of complex IC systems is increasingly critical for achieving system performance. Given this, it is important that the on-chip communication archite...
Solid frameworks and toolkits for design and analysis of embedded systems are of high importance, since they enable early reasoning about critical properties of a system. This pap...
Egor R. V. Bondarev, Michel R. V. Chaudron, Peter ...