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GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
14 years 5 months ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh
ISSRE
2006
IEEE
14 years 5 months ago
Queuing Models for Field Defect Resolution Process
This paper explores a novel application of queuing theory to the corrective software maintenance problem to support quantitative balancing between resources and responsiveness. In...
Swapna S. Gokhale, Robert E. Mullen
IMC
2006
ACM
14 years 4 months ago
Understanding churn in peer-to-peer networks
The dynamics of peer participation, or churn, are an inherent property of Peer-to-Peer (P2P) systems and critical for design and evaluation. Accurately characterizing churn requir...
Daniel Stutzbach, Reza Rejaie
VEE
2006
ACM
126views Virtualization» more  VEE 2006»
14 years 4 months ago
A new approach to real-time checkpointing
The progress towards programming methodologies that simplify the work of the programmer involves automating, whenever possible, activities that are secondary to the main task of d...
Antonio Cunei, Jan Vitek
IPPS
2005
IEEE
14 years 4 months ago
Fault-Tolerant Parallel Applications with Dynamic Parallel Schedules
Commodity computer clusters are often composed of hundreds of computing nodes. These generally off-the-shelf systems are not designed for high reliability. Node failures therefore...
Sebastian Gerlach, Roger D. Hersch