As technology scales to 40nm and beyond, intra-die process variability will cause large delay and leakage variations across a chip in addition to expected die-to-die variations. I...
Maryam Ashouei, Muhammad Mudassar Nisar, Abhijit C...
— Within-functional-block fine-grained adaptive dual supply voltage control (FADVC) is proposed to reduce the power of CMOS logic circuits. Both process and design variations wi...
This paper describes a method of part-based gait identification under substantial clothes variations. When clothes types between a gallery and a probe are different, silhouettes f...
Md. Altab Hossain, Wang Junqui, Yasushi Makihara, ...
In this paper, we address the problem of adaptively enriching motion description languages for multi-modal control by systematically enlarging the set of available modes. This pro...
Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
Lide Zhang, Lan S. Bai, Robert P. Dick, Li Shang, ...