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ICCAD
2007
IEEE
124views Hardware» more  ICCAD 2007»
14 years 4 months ago
3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
GLOBECOM
2006
IEEE
14 years 1 months ago
Distributed Bayesian Fault diagnosis in Collaborative Wireless Sensor Networks
Abstract— In this contribution, we propose an efficient collaborative strategy for online change detection, in a distributed sensor network. The collaborative strategy ensures t...
Hichem Snoussi, Cédric Richard
ASPLOS
2011
ACM
12 years 11 months ago
S2E: a platform for in-vivo multi-path analysis of software systems
This paper presents S2E, a platform for analyzing the properties and behavior of software systems. We demonstrate S2E’s use in developing practical tools for comprehensive perfo...
Vitaly Chipounov, Volodymyr Kuznetsov, George Cand...
OPODIS
2004
13 years 9 months ago
Embedded Systems - Challenges and Work Directions
Embedded Systems are components integrating software and hardware jointly and specifically designed to provide given functionalities. These components may be used in many different...
Joseph Sifakis
IWPC
2005
IEEE
14 years 1 months ago
Working Session: Textual Views of Source Code to Support Comprehension
Source code can be viewed in many ways, with each view facilitating access to different information contained within the code. In this working session, we will explore the role th...
Anthony Cox, Michael L. Collard