: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Planning agents often lack the computational resources needed to build full planning trees for their environments. Agent designers commonly overcome this finite-horizon approxima...
Jonathan Sorg, Satinder P. Singh, Richard L. Lewis
The development of informative, admissible heuristics for cost-optimal planning remains a significant challenge in domain-independent planning research. Two techniques are commonl...
Abstract. One of the most successful approaches in automated planning is to use heuristic state-space search. A popular heuristic that is used by a number of state-space planners i...
Menkes van den Briel, J. Benton, Subbarao Kambhamp...
The current best conformant probabilistic planners encode the problem as a bounded length CSP or SAT problem. While these approaches can find optimal solutions for given plan leng...
Daniel Bryce, Subbarao Kambhampati, David E. Smith