Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
PAR-3D (http://sunserver.cdfd.org.in:8080/protease /PAR_3D/index.html) is a web-based tool that exploits the fact that relative juxtaposition of active site residues is a conserve...
A complete authentication system based on fusion of 3D face and hand biometrics is presented and evaluated in this paper. The system relies on a low cost real-time sensor, which c...
Skeleton of 3D mesh is a fundamental shape feature, and is useful for shape description and other many applications in 3D Digital Geometry Processing. This paper presents a novel s...
3D parametric deformable models have been used to extract volumetric object boundaries and they generate smooth boundary surfaces as results. However, in some segmentation cases, ...
Tian Shen, Xiaolei Huang, Hongsheng Li, Edward Kim...