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DAC
2012
ACM
11 years 10 months ago
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
Xin Zhao, Michael Scheuermann, Sung Kyu Lim
NAR
2007
235views more  NAR 2007»
13 years 7 months ago
PAR-3D: a server to predict protein active site residues
PAR-3D (http://sunserver.cdfd.org.in:8080/protease /PAR_3D/index.html) is a web-based tool that exploits the fact that relative juxtaposition of active site residues is a conserve...
Kshama Goyal, Debasisa Mohanty, Shekhar C. Mande
PRL
2007
160views more  PRL 2007»
13 years 7 months ago
A 3D face and hand biometric system for robust user-friendly authentication
A complete authentication system based on fusion of 3D face and hand biometrics is presented and evaluated in this paper. The system relies on a low cost real-time sensor, which c...
Filareti Tsalakanidou, Sotiris Malassiotis, Michae...
COMSIS
2010
13 years 5 months ago
3D mesh skeleton extraction using prominent segmentation
Skeleton of 3D mesh is a fundamental shape feature, and is useful for shape description and other many applications in 3D Digital Geometry Processing. This paper presents a novel s...
Xiaopeng Sun, J. Pan, Xiaopeng Wei
ICCV
2011
IEEE
12 years 7 months ago
A 3D Laplacian-Driven Parametric Deformable Model
3D parametric deformable models have been used to extract volumetric object boundaries and they generate smooth boundary surfaces as results. However, in some segmentation cases, ...
Tian Shen, Xiaolei Huang, Hongsheng Li, Edward Kim...