3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
ACT Benchmarks are an immensely useful tool in performing research since they allow for rapid and clear comparison between different approaches to solving CAD problems. Recent expe...
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
Title of thesis: EFFICIENT AND ACCURATE STATISTICAL TIMING ANALYSIS FOR NON-LINEAR NON-GAUSSIAN VARIABILITY WITH INCREMENTAL ATTRIBUTES Ashish Dobhal, Master of Science, 2006 Thes...
The continual shrinkage of minimum feature size in integrated circuit (IC) fabrication incurs more and more serious distortion in the optical lithography process, generating circu...