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GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
14 years 2 months ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh
ASPDAC
2008
ACM
127views Hardware» more  ASPDAC 2008»
13 years 10 months ago
Power grid analysis benchmarks
ACT Benchmarks are an immensely useful tool in performing research since they allow for rapid and clear comparison between different approaches to solving CAD problems. Recent expe...
Sani R. Nassif
JETC
2008
127views more  JETC 2008»
13 years 6 months ago
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
Yong Zhan, Sachin S. Sapatnekar
VLSID
2007
IEEE
149views VLSI» more  VLSID 2007»
14 years 8 months ago
Efficient and Accurate Statistical Timing Analysis for Non-Linear Non-Gaussian Variability With Incremental Attributes
Title of thesis: EFFICIENT AND ACCURATE STATISTICAL TIMING ANALYSIS FOR NON-LINEAR NON-GAUSSIAN VARIABILITY WITH INCREMENTAL ATTRIBUTES Ashish Dobhal, Master of Science, 2006 Thes...
Ashish Dobhal, Vishal Khandelwal, Ankur Srivastava
ICIP
2008
IEEE
14 years 10 months ago
Inverse image problem of designing phase shifting masks in optical lithography
The continual shrinkage of minimum feature size in integrated circuit (IC) fabrication incurs more and more serious distortion in the optical lithography process, generating circu...
Stanley H. Chan, Edmund Y. Lam