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IPCV
2007
15 years 6 months ago
Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights
- The shrunk dimension of electronic devices leads to more stringent requirement on process control and quality assurance of their fabrication. For instance, direct die-to-die bond...
Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. ...
ACL
2006
15 years 5 months ago
Aligning Features with Sense Distinction Dimensions
In this paper we present word sense disambiguation (WSD) experiments on ten highly polysemous verbs in Chinese, where significant performance improvements are achieved using rich ...
Nianwen Xue, Jinying Chen, Martha Palmer
ANLP
1997
186views more  ANLP 1997»
15 years 5 months ago
Software Infrastructure for Natural Language Processing
We classify and review current approaches to software infrastructure for research, development and delivery of NLP systems. The task is motivated by a discussion of current trends...
Hamish Cunningham, Kevin Humphreys, Robert J. Gaiz...
MM
2010
ACM
243views Multimedia» more  MM 2010»
15 years 4 months ago
Mobile product recognition
We present a mobile product recognition system for the camera-phone. By snapping a picture of a product with a camera-phone, the user can retrieve online information of the produc...
Sam S. Tsai, David M. Chen, Vijay Chandrasekhar, G...
JCIT
2008
172views more  JCIT 2008»
15 years 4 months ago
Rough Wavelet Hybrid Image Classification Scheme
This paper introduces a new computer-aided classification system for detection of prostate cancer in Transrectal Ultrasound images (TRUS). To increase the efficiency of the comput...
Hala S. Own, Aboul Ella Hassanien