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SLIP
2009
ACM
14 years 2 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
NETWORK
2008
151views more  NETWORK 2008»
13 years 7 months ago
Minimizing information leakage in the DNS
The Domain Name System (DNS) is the global lookup service for network resources. To protect DNS information, the DNS Security Extensions (DNSSEC) have been developed and deployed ...
Scott Rose, Anastase Nakassis
INFOCOM
2003
IEEE
14 years 28 days ago
Integrating effective-bandwidth-based QoS routing and best effort routing
—A methodology is presented for integrating effective-bandwidth-based routing for QoS-sensitive traffic and datagram routing of the best-effort traffic. To prevent excessive dela...
Stephen L. Spitler, Daniel C. Lee
TPDS
2002
141views more  TPDS 2002»
13 years 7 months ago
Integration of Pricing with Call Admission Control to Meet QoS Requirements in Cellular Networks
Call Admission Control (CAC) plays a significant role in providing the desired Quality of Service (QoS) in cellular networks. Traditional CAC schemes that mainly focus on the trade...
Jiongkuan Hou, Jie Yang, Symeon Papavassiliou
DASFAA
2007
IEEE
191views Database» more  DASFAA 2007»
13 years 11 months ago
ABIDE: A Bid-Based Economic Incentive Model for Enticing Non-cooperative Peers in Mobile-P2P Networks
In mobile ad-hoc peer-to-peer (M-P2P) networks, a large percentage of the mobile peers typically do not provide any service to the network, thereby motivating incentive schemes for...
Anirban Mondal, Sanjay Kumar Madria, Masaru Kitsur...