82 search results - page 4 / 17 » Clockless IC design using handshake technology |
DAC
2007
ACM
14 years 8 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
IEEEIAS
2009
IEEE
14 years 2 months ago
2009
IEEE
—There have been several studies on using computer technologies to improve elections and these studies lead to widespread adoption of “direct recording electronic” (DRE) voti...
ISPD
2005
ACM
14 years 1 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
TE
2010
13 years 2 months ago
2010
Abstract--As demand increases for circuits with higher performance, higher complexity, and decreased feature size, asynchronous (clockless) paradigms will become more widely used i...
SLIP
2009
ACM
14 years 1 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...