A Robotic System is being developed to automate the crucible packing process in the CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly ...
In the context of shape and image modeling by manifold learning, we focus on the problem of denoising. A set of shapes or images being known through given samples, we capture its s...
A proper segmentation of pen marking enhances shape recognition and enables a natural interface for sketch-based modeling from simple line drawing tools to 3D solid modeling appli...
Due to the increasing amount of 3D data for various applications there is a growing need for classification and search in such databases. As the representation of 3D objects is no...
Multi-material 3D-printing technologies permit the freeform fabrication of complex spatial arrangements of materials in arbitrary geometries. This technology has opened the door t...