—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
This paper focuses on the assignment of discrete points among K robots and determining the order in which the points should be processed by the robots, in the presence of geometric...
Nilanjan Chakraborty, Srinivas Akella, John T. Wen
Orphan requests are a significant problem for multi-tier distributed systems since they adversely impact system correctness by violating the exactly-once semantics of application...
We propose a system architecture for real-time hardware speech recognition on low-cost, power-constrained devices. The system is intended to support real-time speech-based user in...
Tiling is a widely used loop transformation for exposing/exploiting parallelism and data locality. Effective use of tiling requires selection and tuning of the tile sizes. This is...