Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
Chunyang Feng, Hai Zhou, Changhao Yan, Jun Tao, Xu...
The complexity and physical distribution of modern active-safety automotive applications requires the use of distributed architectures. These architectures consist of multiple ele...
Abhijit Davare, Qi Zhu, Marco Di Natale, Claudio P...
We discover significant value-dependent programming energy variations in multi-level cell (MLC) flash memories, and introduce an energy-aware data compression method that minimize...
We describe METRICS, a system to recover design productivity via new infrastructure for design process optimization. METRICS seeks to treat system design and implementation as a s...
Stephen Fenstermaker, David George, Andrew B. Kahn...
The increased deployment of System-on-Chip designs has drawn attention to the limitations of on-chip interconnects. As a potential solution to these limitations, Networks-on -Chip...
Jongman Kim, Dongkook Park, Theo Theocharides, Nar...