374 search results - page 47 / 75 » Deployment automation with BLITZ |
DAC
2009
ACM
14 years 9 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
DAC
2007
ACM
14 years 9 months ago
2007
ACM
The complexity and physical distribution of modern active-safety automotive applications requires the use of distributed architectures. These architectures consist of multiple ele...
DAC
2007
ACM
14 years 9 months ago
2007
ACM
We discover significant value-dependent programming energy variations in multi-level cell (MLC) flash memories, and introduce an energy-aware data compression method that minimize...
DAC
2000
ACM
14 years 9 months ago
2000
ACM
We describe METRICS, a system to recover design productivity via new infrastructure for design process optimization. METRICS seeks to treat system design and implementation as a s...
DAC
2005
ACM
14 years 9 months ago
2005
ACM
The increased deployment of System-on-Chip designs has drawn attention to the limitations of on-chip interconnects. As a potential solution to these limitations, Networks-on -Chip...