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DAC
2012
ACM
12 years 14 days ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
DEXA
2005
Springer
90views Database» more  DEXA 2005»
14 years 3 months ago
Transaction Management with Integrity Checking
Abstract. Database integrity constraints, understood as logical conditions that must hold for any database state, are not fully supported by current database technology. It is typi...
Davide Martinenghi, Henning Christiansen
ASAP
2002
IEEE
76views Hardware» more  ASAP 2002»
14 years 3 months ago
A Component Architecture for FPGA-Based, DSP System Design
† Introducing FPGA components into DSP system implementations creates an assortment of challenges across system architecture and logic design. Recognizing that some of the greate...
Gary Spivey, Shuvra S. Bhattacharyya, Kazuo Nakaji...
FCCM
2005
IEEE
107views VLSI» more  FCCM 2005»
14 years 3 months ago
Simplifying the Integration of Processing Elements in Computing Systems Using a Programmable Controller
As technology sizes decrease and die area increases, designers are creating increasingly complex computing systems using FPGAs. To reduce design time for new products, the reuse o...
Lesley Shannon, Paul Chow
ESORICS
2007
Springer
14 years 4 months ago
SilentKnock: Practical, Provably Undetectable Authentication
Port knocking is a technique first introduced in the blackhat and trade literature to prevent attackers from discovering and exploiting potentially vulnerable services on a networ...
Eugene Y. Vasserman, Nicholas Hopper, John Laxson,...