The automotive electronics industry is experiencing an era of unprecedented growth. Driven by emissions and safety legislation, fuel economy constraints, cost constraints, and cus...
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
Changes in the underpinning technologies for TEL is occurring at a pace that we have never before experienced, and this is unlikely to slow down. This necessitates a broader and mo...
Andrew Ravenscroft, Tom Boyle, John Cook, Andreas ...
Typically viewed as competing design approaches, this paper illustrates how claims and personas can be used together in user interface design. Our combined approach is exemplified...
Justin Belcher, Raheel Aidrus, Ben Congleton, Doug...
The keeping of secrets and practicing of deception are commonplace in everyday social interaction. They also serve an important role in encouraging social cohesion. However, for H...
Adam N. Joinson, Jeffrey T. Hancock, Pamela Briggs