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TCAD
2008
114views more  TCAD 2008»
13 years 10 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
JSAC
2007
132views more  JSAC 2007»
13 years 10 months ago
Lifetime maximization via cooperative nodes and relay deployment in wireless networks
— Extending lifetime of battery-operated devices is a key design issue that allows uninterrupted information exchange among distributed nodes in wireless networks. Cooperative co...
Thanongsak Himsoon, W. Pam Siriwongpairat, Zhu Han...
TVLSI
2008
105views more  TVLSI 2008»
13 years 10 months ago
Robust Concurrent Online Testing of Network-on-Chip-Based SoCs
Lifetime concerns for complex systems-on-a-chip (SoC) designs due to decreasing levels in reliability motivate the development of solutions to ensure reliable operation. A precurso...
Praveen Bhojwani, Rabi N. Mahapatra
URBAN
2008
99views more  URBAN 2008»
13 years 10 months ago
A comparison of address point, parcel and street geocoding techniques
The widespread availability of powerful geocoding tools in commercial GIS software and the interest in spatial analysis at the individual level have made address geocoding a widel...
Paul A. Zandbergen
PAMI
2002
150views more  PAMI 2002»
13 years 10 months ago
Object Tracking with Bayesian Estimation of Dynamic Layer Representations
Decomposing video frames into coherent two-dimensional motion layers is a powerful method for representing videos. Such a representation provides an intermediate description that e...
Hai Tao, Harpreet S. Sawhney, Rakesh Kumar