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CORR
2008
Springer
84views Education» more  CORR 2008»
13 years 7 months ago
Novel Bonding technologies for wafer-level transparent packaging of MOEMS
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...
CORR
2010
Springer
59views Education» more  CORR 2010»
13 years 6 months ago
Refinement and Verification of Real-Time Systems
This paper discusses highly general mechanisms for specifying the refinement of a real-time system as a collection of lower level parallel components that preserve the timing and ...
Paul Z. Kolano, Carlo A. Furia, Richard A. Kemmere...
CORR
2010
Springer
158views Education» more  CORR 2010»
13 years 2 months ago
Efficient Approaches for Designing Fault Tolerant Reversible Carry Look-Ahead and Carry-Skip Adders
Combinational or Classical logic circuits dissipate heat for every bit of information that is lost. Information is lost when the input vector cannot be recovered from its correspon...
Md. Saiful Islam 0003, Muhammad Mahbubur Rahman, Z...
TITB
2010
165views Education» more  TITB 2010»
13 years 2 months ago
On combining morphological component analysis and concentric morphology model for mammographic mass detection
Mammographic mass detection is an important task for the early diagnosis of breast cancer. However, it is difficult to distinguish masses from normal regions because of their abund...
Xinbo Gao, Ying Wang, Xuelong Li, Dacheng Tao
TITS
2010
117views Education» more  TITS 2010»
13 years 2 months ago
Lane-Level Integrity Provision for Navigation and Map Matching With GNSS, Dead Reckoning, and Enhanced Maps
Lane-level positioning and map matching are some of the biggest challenges for navigation systems. Additionally, in safety applications or in those with critical performance requir...
Rafael Toledo-Moreo, David Bétaille, Fran&c...