3006 search results - page 138 / 602 » Dimensionality reduction and generalization |
163
click to vote
TCAD
2008
15 years 3 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
179
Voted
ISCA
2007
IEEE
15 years 3 months ago
2007
IEEE
Hyperspectral sensors represent the most advanced instruments currently available for remote sensing of the Earth. The high spatial and spectral resolution of the images supplied ...
140
Voted
TMI
2008
15 years 3 months ago
2008
Abstract--Due to the significant complexity of membrane morphology and the generally poor image quality in electron tomographic volumes, current automatic methods for segmentation ...
132
Voted
TPDS
1998
15 years 3 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
142
click to vote
TVCG
2002
15 years 3 months ago
2002
Image databases are nowadays widely exploited in a number of different contexts, ranging from history of art, through medicine, to education. Existing querying paradigms are based ...