The extremely low latencies and high bandwidth results achievable with the Scalable Coherent Interface SCI at lowest level encourages its integration into existing Message Passin...
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
We present a new model of interactive audio for entertainment and communication. A new device called the DJammer and its associated technologies are described. The DJammer introdu...
Nowadays, wireless sensor networks have been widely used in many monitoring applications. Due to the low quality of sensors and random effects of the environment, however, it is ...
Yongzhen Zhuang, Lei Chen 0002, Xiaoyang Sean Wang...
The increasing availability of information about people's context makes it possible to deploy context-sensitive services, where access to resources provided or managed by a s...