7 search results - page 1 / 2 » Economic efficiency analysis of wafer fabrication facilities |
WSC
2008
14 years 1 months ago
2008
Semiconductor industry is capital intensive and competitive, and thus efficiently utilizing resources to provide products and services is essential for maintaining competitive adv...
WSC
2007
14 years 1 months ago
2007
This paper presents a new job release methodology, WIPLOAD Control, especially in semiconductor wafer fabrication environment. The performance of the proposed methodology is evalu...
EOR
2007
13 years 10 months ago
2007
: New semiconductor wafer fabrication facilities use Front Opening Unified Pods (FOUPs) as a common unit of wafer transfer. Since the number of pods is limited due to high costs, a...
WSC
2004
14 years 7 days ago
2004
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
WSC
2008
14 years 1 months ago
2008
As an adaptation of the CONWIP concept, AMD has developed a heuristic approach to control the WIP in its wafer fabrication facilities (fabs). The so called "Loop Control"...