7 search results - page 1 / 2 » Economic efficiency analysis of wafer fabrication facilities |
WSC
2008
13 years 10 months ago
2008
Semiconductor industry is capital intensive and competitive, and thus efficiently utilizing resources to provide products and services is essential for maintaining competitive adv...
WSC
2007
13 years 10 months ago
2007
This paper presents a new job release methodology, WIPLOAD Control, especially in semiconductor wafer fabrication environment. The performance of the proposed methodology is evalu...
EOR
2007
13 years 7 months ago
2007
: New semiconductor wafer fabrication facilities use Front Opening Unified Pods (FOUPs) as a common unit of wafer transfer. Since the number of pods is limited due to high costs, a...
WSC
2004
13 years 9 months ago
2004
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
WSC
2008
13 years 10 months ago
2008
As an adaptation of the CONWIP concept, AMD has developed a heuristic approach to control the WIP in its wafer fabrication facilities (fabs). The so called "Loop Control"...