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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
14 years 3 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
PLDI
2005
ACM
14 years 3 months ago
Programming ad-hoc networks of mobile and resource-constrained devices
Ad-hoc networks of mobile devices such as smart phones and PDAs represent a new and exciting distributed system architecture. Building distributed applications on such an architec...
Yang Ni, Ulrich Kremer, Adrian Stere, Liviu Iftode
SI3D
2005
ACM
14 years 3 months ago
Volume catcher
It is difficult to obtain a specific region within unsegmented volume data (region of interest, ROI). The user must first segment the volume, a task which itself involves signi...
Shigeru Owada, Frank Nielsen, Takeo Igarashi
SMA
2005
ACM
167views Solid Modeling» more  SMA 2005»
14 years 3 months ago
Boolean operations on 3D selective Nef complexes: optimized implementation and experiments
Nef polyhedra in d-dimensional space are the closure of half-spaces under boolean set operation. In consequence, they can represent non-manifold situations, open and closed sets, ...
Peter Hachenberger, Lutz Kettner
CVBIA
2005
Springer
14 years 3 months ago
Analyzing Anatomical Structures: Leveraging Multiple Sources of Knowledge
Analysis of medical images, especially the extraction of anatomical structures, is a critical component of many medical applications: surgical planning and navigation, and populati...
W. Eric L. Grimson, Polina Golland