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TCAD
2008
114views more  TCAD 2008»
13 years 7 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
VLSISP
2008
173views more  VLSISP 2008»
13 years 7 months ago
Fast Bit Gather, Bit Scatter and Bit Permutation Instructions for Commodity Microprocessors
Advanced bit manipulation operations are not efficiently supported by commodity word-oriented microprocessors. Programming tricks are typically devised to shorten the long sequence...
Yedidya Hilewitz, Ruby B. Lee
TPDS
1998
129views more  TPDS 1998»
13 years 7 months ago
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
W. Stephen Lacy, José Cruz-Rivera, D. Scott...
TCSV
2002
119views more  TCSV 2002»
13 years 7 months ago
VLSI architecture design of MPEG-4 shape coding
This paper presents an efficient VLSI architecture design of MPEG-4 shape coding, which is the key technology for supporting the content-based functionality of the MPEG-4 Video sta...
Hao-Chieh Chang, Yung-Chi Chang, Yi-Chu Wang, Wei-...
ANCS
2010
ACM
13 years 5 months ago
Ensemble routing for datacenter networks
: Ensemble Routing For Datacenter Networks Mike Schlansker, Yoshio Turner, Jean Tourrilhes, Alan Karp HP Laboratories HPL-2010-120 Networks, Ethernet, Multipath, Switching, Fault ...
Mike Schlansker, Yoshio Turner, Jean Tourrilhes, A...