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TCAD
2008
114views more  TCAD 2008»
13 years 7 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
CG
2010
Springer
13 years 6 months ago
The effect of task on classification accuracy: Using gesture recognition techniques in free-sketch recognition
Generating, grouping, and labeling free-sketch data is a difficult and time-consuming task for both user study participants and researchers. To simplify this process for both part...
M. Field, S. Gordon, Eric Jeffrey Peterson, R. Rob...
MOBISYS
2010
ACM
13 years 10 months ago
Augmenting mobile 3G using WiFi
We investigate if WiFi access can be used to augment 3G capacity in mobile environments. We first conduct a detailed study of 3G and WiFi access from moving vehicles, in three dif...
Aruna Balasubramanian, Ratul Mahajan, Arun Venkata...