Sciweavers

107 search results - page 22 / 22
» Finding optimal hardware software partitions
Sort
View
TCAD
2008
114views more  TCAD 2008»
13 years 7 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
MOBISYS
2007
ACM
14 years 7 months ago
Triage: balancing energy and quality of service in a microserver
The ease of deployment of battery-powered and mobile systems is pushing the network edge far from powered infrastructures. A primary challenge in building untethered systems is of...
Nilanjan Banerjee, Jacob Sorber, Mark D. Corner, S...