Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
The ease of deployment of battery-powered and mobile systems is pushing the network edge far from powered infrastructures. A primary challenge in building untethered systems is of...
Nilanjan Banerjee, Jacob Sorber, Mark D. Corner, S...