Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
We want to perform compile-time analysis of an SPMD program and place barriers in it to synchronize it correctly, minimizing the runtime cost of the synchronization. This is the b...
This paper presents a decentralized task allocation method that can handle allocation of tasks with time and precedence constraints in a multi-agent setting where not all informat...
Mark Hoogendoorn, Maria L. Gini, Catholijn M. Jonk...
Sleeping is an important method to reduce energy consumption in many information and communication systems. In this paper we focus on a typical server under dynamic load, where en...
Ioannis Kamitsos, Lachlan L. H. Andrew, Hongseok K...
We address the combinatorial optimization problem of finding the most influential nodes on a large-scale social network for two widely-used fundamental stochastic diffusion models...