2 search results - page 1 / 1 » Hierarchical dummy fill for process uniformity |
ASPDAC
2001
ACM
14 years 2 months ago
2001
ACM
DAC
2009
ACM
14 years 12 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...