2 search results - page 1 / 1 » Hierarchical dummy fill for process uniformity |
ASPDAC
2001
ACM
15 years 6 months ago
2001
ACM
107
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DAC
2009
ACM
16 years 4 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...