12 search results - page 3 / 3 » Improving cache lifetime reliability at ultra-low voltages |
TPDS
2010
13 years 5 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
ISPASS
2008
IEEE
14 years 1 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...