Measurement studies indicate a high rate of node dynamics in p2p systems. In this paper, we address the question of how high a rate of node dynamics can be supported by structured...
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
Abstract— Power consumption has become a crucial problem in modern circuit design. Multiple Supply Voltage (MSV) design is introduced to provide higher flexibility in controllin...
Performance and power are the first order design metrics for Network-on-Chips (NoCs) that have become the de-facto standard in providing scalable communication backbones for mult...
Asit K. Mishra, Reetuparna Das, Soumya Eachempati,...
As memory speeds and bus capacitances continue to rise, external memory bus power will make up an increasing portion of the total system power budget for system-on-a-chip embedded...