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TCAD
2008
114views more  TCAD 2008»
13 years 7 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
JSA
2000
116views more  JSA 2000»
13 years 7 months ago
Distributed vector architectures
Integrating processors and main memory is a promising approach to increase system performance. Such integration provides very high memory bandwidth that can be exploited efficientl...
Stefanos Kaxiras
PVLDB
2008
182views more  PVLDB 2008»
13 years 6 months ago
SCOPE: easy and efficient parallel processing of massive data sets
Companies providing cloud-scale services have an increasing need to store and analyze massive data sets such as search logs and click streams. For cost and performance reasons, pr...
Ronnie Chaiken, Bob Jenkins, Per-Åke Larson,...
HIPC
2009
Springer
13 years 5 months ago
Fast checkpointing by Write Aggregation with Dynamic Buffer and Interleaving on multicore architecture
Large scale compute clusters continue to grow to ever-increasing proportions. However, as clusters and applications continue to grow, the Mean Time Between Failures (MTBF) has redu...
Xiangyong Ouyang, Karthik Gopalakrishnan, Tejus Ga...
POPL
2009
ACM
14 years 8 months ago
Feedback-directed barrier optimization in a strongly isolated STM
Speed improvements in today's processors have largely been delivered in the form of multiple cores, increasing the importance of ions that ease parallel programming. Software...
Nathan Grasso Bronson, Christos Kozyrakis, Kunle O...