162 search results - page 4 / 33 » Interconnect Analysis: From 3-D Structures to Circuit Models |
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
ICCV
2007
IEEE
14 years 9 months ago
2007
IEEE
In this paper we propose a new framework to simultaneously segment and register lung and tumor in serial CT data. Our method assumes nonrigid transformation on lung deformation an...
ISBI
2011
IEEE
12 years 11 months ago
2011
IEEE
Object boundary extraction is an important task in brain image analysis. Acquiring detailed 3D representations of the brain structures could improve the detection rate of diseases...
ICCV
1995
IEEE
13 years 11 months ago
1995
IEEE
We present a novel motion-based approach for the part determination and shape estimation of a human’s body parts. The novelty of the technique is that neither a prior model of t...
CRV
2008
IEEE
14 years 2 months ago
2008
IEEE
Recent advancements in laser and visible light sensor technology allows for the collection of photorealistic 3D scans of large scale spaces. This enables the technology to be used...