This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming ...
Bandwidth and processing requirements of conventional multimedia applications typically exceed capabilities of current technology portable terminals. Applications should hence be ...
Evaluating competing technologies on a common problem set is a powerful way to improve the state of the art and hasten technology transfer. Yet poorly designed evaluations can was...
: We are building an infrastructure for the platform-independent distribution and execution of high-performance mobile code as a future Internet technology to complement and perhap...
The Workshop included an extended group of presentations by selected US government agencies and an invited guest from the European Community. These presentations, amplified in the...