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ISQED
2003
IEEE
86views Hardware» more  ISQED 2003»
15 years 10 months ago
Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform
This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming ...
ESTIMEDIA
2003
Springer
15 years 10 months ago
Performance characterization of a low-cost video codec on portable devices
Bandwidth and processing requirements of conventional multimedia applications typically exceed capabilities of current technology portable terminals. Applications should hence be ...
Giulio Iannello, Luca Vollero, Francesco Delfino
NAACL
2003
15 years 6 months ago
Evaluating the Evaluation: A Case Study Using the TREC 2002 Question Answering Track
Evaluating competing technologies on a common problem set is a powerful way to improve the state of the art and hasten technology transfer. Yet poorly designed evaluations can was...
Ellen M. Voorhees
WEBNET
1997
15 years 6 months ago
Beyond Java: An Infrastructure for High-Performance Mobile Code on the World Wide Web
: We are building an infrastructure for the platform-independent distribution and execution of high-performance mobile code as a future Internet technology to complement and perhap...
Michael Franz
NAACL
1994
15 years 6 months ago
Session 10: Government Panel
The Workshop included an extended group of presentations by selected US government agencies and an invited guest from the European Community. These presentations, amplified in the...
Oscar N. Garcia