Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
— Instantaneous Fair Sharing (IFS) is a traditional network ideal prescribing to share the network capacity among competing applications fairly during any infinitesimal time int...
Materialized views are nowadays commonly used in the data warehouse environment. Materialized views need to be updated when data sources change. Since the update of the views may ...
Abstract--Over-sampling sigma-delta analog-todigital converters (ADCs) are one of the key building blocks of state of the art wireless transceivers. In sigma-delta modulator design...
It is well known that dynamic typing in languages like Lisp is costly in terms of performance. Besides the cost of tag checking, the other major source of ine ciency comes from th...