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TPDS
1998
13 years 7 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
CORR
2011
Springer
12 years 11 months ago
2011
Springer
Many complex systems, from power grids and the internet, to the brain and society, can be modeled using modular networks. Modules, densely interconnected groups of elements, often...
OSDI
2008
ACM
14 years 8 months ago
2008
ACM
We present Quanto, a network-wide time and energy profiler for embedded network devices. By combining well-defined interfaces for hardware power states, fast high-resolution energ...
TON
2010
13 years 6 months ago
2010
Abstract—In this paper, we investigate the suitability of embedding Internet hosts into a Euclidean space given their pairwise distances (as measured by round-trip time). Using t...
IPPS
2006
IEEE
14 years 1 months ago
2006
IEEE
An execution environment consisting of virtual machines (VMs) interconnected with a virtual overlay network can use the naturally occurring traffic of an existing, unmodified ap...