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» Meeting the Embedded Design Needs of Automotive Applications
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TPDS
1998
129views more  TPDS 1998»
13 years 7 months ago
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
W. Stephen Lacy, José Cruz-Rivera, D. Scott...
ASAP
2010
IEEE
171views Hardware» more  ASAP 2010»
13 years 7 months ago
General-purpose FPGA platform for efficient encryption and hashing
Many applications require protection of secret or sensitive information, from sensor nodes and embedded applications to large distributed systems. The confidentiality of data can b...
Jakub Szefer, Yu-Yuan Chen, Ruby B. Lee
PLDI
2005
ACM
14 years 29 days ago
Pin: building customized program analysis tools with dynamic instrumentation
Robust and powerful software instrumentation tools are essential for program analysis tasks such as profiling, performance evaluation, and bug detection. To meet this need, we ha...
Chi-Keung Luk, Robert S. Cohn, Robert Muth, Harish...
ICML
1998
IEEE
14 years 8 months ago
Q2: Memory-Based Active Learning for Optimizing Noisy Continuous Functions
This paper introduces a new algorithm, Q2, foroptimizingthe expected output ofamultiinput noisy continuous function. Q2 is designed to need only a few experiments, it avoids stron...
Andrew W. Moore, Jeff G. Schneider, Justin A. Boya...
CIKM
2004
Springer
14 years 24 days ago
Composable XML integration grammars
The proliferation of XML as a standard for data representation and exchange in diverse, next-generation Web applications has created an emphatic need for effective XML data-integr...
Wenfei Fan, Minos N. Garofalakis, Ming Xiong, Xibe...