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CAD
2011
Springer
13 years 1 months ago
Industrial design using interpolatory discrete developable surfaces
Design using free-form developable surfaces plays an important role in manufacturing industry. Currently most commercial systems can only support converting free-form surfaces int...
Yong-Jin Liu, Kai Tang, Wen-Yong Gong, Tie-Ru Wu
CHI
2011
ACM
13 years 1 months ago
Playable data: characterizing the design space of game-y infographics
This work explores the intersection between infographics and games by examining how to embed meaningful visual analytic interactions into game mechanics that in turn impact user b...
Nicholas Diakopoulos, Funda Kivran-Swaine, Mor Naa...
DSN
2011
IEEE
12 years 9 months ago
Cross-layer resilience using wearout aware design flow
—As process technology shrinks devices, circuits experience accelerated wearout. Monitoring wearout will be critical for improving the efficiency of error detection and correctio...
Bardia Zandian, Murali Annavaram
ASPDAC
2012
ACM
238views Hardware» more  ASPDAC 2012»
12 years 5 months ago
Design for manufacturability and reliability for TSV-based 3D ICs
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
ASPDAC
2012
ACM
279views Hardware» more  ASPDAC 2012»
12 years 5 months ago
Block-level 3D IC design with through-silicon-via planning
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim